In einem prozessübergreifenden Gemeinschaftsprojekt haben Experten des Fraunhofer Instituts (FhG IZM Berlin) mit Herstellern der Elektronikindustrie ASM Assembly Systems, ASYS,...
reflow
After having described the influence of aperture variations and vacuum on the number of voids and void content in BTCs...
Now that the issue of soldering with vacuum profiles has been introduced in part 1, we’ll take a closer look...
La première partie a permis une première approche du sujet du brasage avec des profils de vide. La deuxième partie...
Dopo che nella prima parte vi abbiamo dato un’infarinatura sull’argomento “Saldatura con profili sottovuoto”, nella seconda parte illustreremo un approfondimento...